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The Mechanical Engineer will design, analyze, and integrate mechanical and thermal solutions for RF subsystems, collaborating with various teams and overseeing fabrication and testing.
Top Skills:
AnsysComsolSolidworks
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The Linux HPC Systems Engineer will administer Linux systems, manage HPC clusters, and implement new technologies while ensuring system performance and compliance.
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General Description:
The ideal candidate will contribute technical expertise and work within a fast-paced team of scientists and engineers on the development of next generation RF/mmWave Subsystems. Candidate will be expected to work within diverse teams taking responsibility for the design, FEA modeling, implementation, and integration of mechanical and thermal solutions for advanced RF prototypes.
Essential Duties:
Work with RF and electrical engineering teams to design mechanical and thermal assemblies to meet customer requirements.
Perform thermal and structural analysis of mechanical assemblies and thermal management systems for electronics and RF subsystems
Lead the development of mechanical assemblies and thermal management systems from design through fabrication, integration and testing.
Prepare comprehensive documentation including design specifications, component drawings, assembly drawings, tolerance analysis and interface control documents with application of GD&T
Support design reviews and implement design for manufacturing principles.
Perform or oversee fabrication and testing of assemblies.
Required Skills:
Must be proficient with SolidWorks to create detailed 3D models and technical drawings of components and assemblies
General knowledge of GD&T is required and how it relates to processing methods
Experience with FEA analysis tools such as Ansys or COMSOL
At least 4 years of experience designing, implementing, and testing mechanical assemblies and/or thermal management systems
Working knowledge of mechanical and thermal design principles from the component to subsystem level, including operation, controls, safety, etc.
Understanding of structural and thermal analysis and fluid dynamics
Familiarity with MILSPEC standards and qualification of hardware for DoD applications
Proficiency in use of computers, engineering work stations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
Ability to work well in a team and independently
Understanding of ASME Y14.5. and ASME Y14.100 is a plus.
Basic understanding of electronic and/or RF systems is a plus.
Understanding of RF components and devices
Working knowledge of electronic parts and components, including connectors, cables, printed circuit boards and device packages
Product life cycle, vibration, environmental testing experience is a plus.
Required Education:
Bachelor’s Degree or equivalent
Physical Requirements:
Ability and willingness to travel 20% of time.
Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.
Special Requirements:
U.S. Citizen is required. Ability to obtain a security clearance desired.
Compensation:
The base salary range for this full-time position is $132,765 - $165,983 + bonus + benefits.
Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.
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